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Latchup In Cmos Technology The Problem And Its Cure Pdf Download

latchup in cmos technology the problem and its cure pdf download

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If you leave signals applied to the inputs of a CMOS chip with the power turned off, the chip might explode when you re-apply power. This is called latchup. Similarly, if you drag the outputs of a CMOS chip above or below the power supply rails you can latchup the part.

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Electrostatic Discharge, Electrical Overstress, and Latchup in VLSI Microelectronics

Electrostatic discharge ESD , electrical overstress EOS , and latchup have been an issue in devices, circuit and systems for VLSI microelectronics for many decades and continue to be an issue till today. This chapter will address some of the fundamental reasons decisions that are made for choice of circuits and layout. Many publications do not explain why certain choices are made, and we will address these in this chapter. Physical models, failure mechanisms and design solutions will be highlighted. The chapter will close with discussion on how to provide both EOS and ESD robust devices, circuits, and systems, design practices and procedures.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation particle radiation and high-energy electromagnetic radiation , [1] especially for environments in outer space especially beyond the low Earth orbit , around nuclear reactors and particle accelerators , or during nuclear accidents or nuclear warfare. Most semiconductor electronic components are susceptible to radiation damage, and radiation-hardened components are based on their non-hardened equivalents, with some design and manufacturing variations that reduce the susceptibility to radiation damage. Due to the extensive development and testing required to produce a radiation-tolerant design of a microelectronic chip, radiation-hardened chips tend to lag behind the most recent developments. Radiation-hardened products are typically tested to one or more resultant effects tests, including total ionizing dose TID , enhanced low dose rate effects ELDRS , neutron and proton displacement damage, and single event effects SEEs. Environments with high levels of ionizing radiation create special design challenges. A single charged particle can knock thousands of electrons loose, causing electronic noise and signal spikes.

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Latchup In Cmos Technology The Problem And Its Cure

It seems that you're in Germany. We have a dedicated site for Germany. Why a book on Iatchup? Latchup has been, and continues to be, a potentially serious CMOS reliability concern. This concern is becoming more widespread with the ascendency of CMOS as the dominant VLSI technology, particularly as parasitic bipolar characteristics continue to improve at ever smaller dimensions on silicon wafers with ever lower defect densities. Although many successful parts have been marketed, latchup solutions have often been ad hoc.

Radiation hardening

Device design, fabrication and characterization of 0.8 μm CMOS technology

Latchup In Cmos Technology The Problem And Its Cure

What is needed is a more general, more systematic treatment of the latchup problem. Because of the wide variety of CMOS technologies and the long term interest in latchup, some overall guiding principles are needed. Appreciating the variety of possible triggering mechanisms is key to a real understanding of latchup. Get this from a library! Latchup in CMOS technology : the problem and its cure. Early CMOS processes suffered a reliability concern that became known as latchup. It resulted in circuits either malfunctioning or consuming excessive power, and could be either inherent in the design or triggered by voltage spikes on IO pads that Latchup refers to short circuit formed between power rails in an IC leading to high current and damage to the IC.

Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis. This chapter presents an overview of microprocessor and application specific integrated circuit IC testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized.

The Problem and Its Cure

A majority of references are from IEEE publications and can be obtained from ieeexplore. An electronic version of this bibliography with hyperlinks is available at www. Abdollahi, F. Fallah, and M. VLSI , vol. Design Automation Conf.

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